Other Significant Features
- Single Edge Processor Package (SEPP), which is similar to the Single
Edge Contact (SEC) cartridge form factor that the Pentium II processor
uses, and maintains compatibility with Slot 1. This packaging technology
features a P6-microarchitecture-based core processor on a single-sided
substrate without BSRAM componentry. It does not have a
thermal plate or cover. The 0.25 micron manufacturing process, which
reduces processor heat, enables the Intel Celeron processor to use a
smaller heat sink. Also, the Intel Celeron processor uses newer
Retention Mechanisms that are designed to fit the SEPP form factor.
- The system bus supports multiple outstanding transactions to increase
bandwidth availability.
- Incorporates separate 16K level-one caches, one for instructions and
one for data.
- A pipelined Floating-Point Unit (FPU) for supporting the 32-bit
and 64-bit formats specified in IEEE standard 754, as well as an
80-bit format.
- Parity-protected address/request and response system bus signals
with a retry mechanism for high data integrity and reliability.
Testing and Performance Monitoring Features
- Built-in Self Test (BIST), providing single stuck-at fault coverage of the
microcode and large logic arrays, as well as testing of the instruction
cache, data cache, Translation Lookaside Buffers (TLBs) and ROMs.
- IEEE 1149.1 Standard Test Access Port and Boundary Scan
mechanism, enables testing of the Intel Celeron processor and
system connections through a standard interface.
- Internal performance counters for performance monitoring and
event counting.
Performance Specifications